Vessl's Founder & CEO Walter D. Apodaca, Jr. commented, "This agreement is a testament to our shared commitment to pushing the boundaries of what is possible in packaging technology. We believe we can create solutions that not only meet but exceed the expectations of consumers and companies worldwide and propel the evolution of on-the-go thermal solutions."
"Tempra is excited to work with Vessl on this project," stated Barney J. Guarino, Founder & CEO of Tempra Technology. "Our self-heating and self-chilling technologies, when combined with Vessl's innovative packaging solutions, undoubtedly will set new benchmarks for convenience, sustainability, and functionality in the industry."
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Vessl, Inc. and Tempra Technology, Inc. Sign Agreement to Develop Innovative Packaging Solutions
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Vessl, Inc. announced that it entered into a Development Agreement with Tempra Technology, Inc. whereby Vessl will adapt its patented Vessl® Technology to mix ingredients for use with Tempra's patented self-heating packaging applications. The Development Agreement provides for Vessl to develop its technology in order to help Tempra deliver more efficient and cost-effective solutions for use with shelf stable meals, beverages, soups and other self-heating and self-cooling applications.