In a move set to redefine smart label technology, California-based semiconductor innovator InPlay Inc. has announced the release of its 2nd-generation NanoBeacon System-on-Chip (SoC), the IN120 a game-changing solution that blends ultra-low power performance with radically simplified design.
Engineered for high-volume smart label manufacturing and disposable IoT applications, the IN120 is poised to shake up industries such as logistics, pharmaceuticals, and cold chain monitoring. Its secret? A groundbreaking minimalist architecture that slashes external component requirements to just one a 26MHz crystal.
“With the IN120, we’re enabling smart label makers to streamline production, cut costs, and scale faster all without compromising on performance,” said Jason Wu, Co-founder and CEO of InPlay Inc.
What Makes the IN120 Stand Out?
- Integrated High-Precision Temperature Sensor
Accuracy of ±1°C ideal for monitoring sensitive goods like vaccines, food, and temperature-regulated shipments. - Ultra-Minimalist Design
Just one external component needed. This simplifies roll-to-roll inlay production, significantly reducing setup times and manufacturing complexity. - High Efficiency and Compatibility
Operates across 1.1V to 3.6V, supporting a wide range of battery types including cost-effective printable batteries perfect for thin, disposable smart labels. - Delivered in Bumped Wafer Known Good Die (KGD) Format
Seamless integration into existing RFID label production infrastructure. - Optional Preprogramming Services
Speeds up manufacturing even further by offering ready-to-deploy chips.
A Leap Toward Smarter, Scalable Packaging
By making active smart labels more cost-effective and efficient while matching the simplicity of passive RFID tags the IN120 opens the floodgates for a new wave of scalable, functional smart packaging.
The IN120 will be available for sampling in Q1 2026, with mass production planned shortly after.