May
04
/ 2021
The patent pending LCS2 product is designed to prevent thin semiconductor components from migrating out of the pockets of waffle pack chip trays during shipping and handling.
"The new LCS2 product has the potential to save semiconductor manufacturers millions of dollars in costs associated with yield loss, rework labor and RMA's caused by die migration" said Darby Davis, VP of Sales and Marketing for Delphon.