In the world of microelectronics, packaging isn't just about protection — it's about precision, performance, and space optimization. LG Innotek has introduced a breakthrough that may redefine how electronic components are packaged within smartphones and wearables. As smartphone brands push the limits of compact design and battery capacity, LG Innotek has introduced a game-changing solution: replacing traditional solder balls with advanced Copper Post technology to connect chip substrates to motherboards.
Rather than bonding solder balls directly to the substrate surface, LG’s method first places copper columns, followed by soldering on top. This innovative layout allows for 20% tighter spacing between joints without sacrificing electrical performance — enabling thinner devices and more space for features like larger batteries.
But the benefits go beyond space-saving: