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#innovation #packaging #technology

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Mark Andy announces partnership with Konica Minolta

07 Jun 2022
Grania Jain
Profile picture for user GraniaJain

Mark Andy is extending its partnership with Konica Minolta to further its capabilities in the digital converting space. Mark Andy has announced it will serve as the exclusive provider of Konica Minolta’s newest technology, the Accurio Label 400 (AL400), for the labels and packaging industry.

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KLA launches new advanced semiconductor packaging techniques

23 Sep 2020
Grania Jain
Profile picture for user GraniaJain

US-based capital equipment company KLA has enhanced its systems portfolio for advanced packaging with the launch of new tools.   

The new tools include the Kronos 1190 wafer-level packaging inspection system, the ICOS F160XP and the ICOS T3/T7 Series.

The systems will allow the customers to advance semiconductor device fabrication at the packaging stage. They will support the customers to overcome a broad range of integrated circuit (IC) challenges.

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