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plas-tech engineering - Supplier for COC/COP PFS Syringes
Schreiner
rochling

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  2. components for processing and packaging a new event during interpack 2014

components for processing and packaging a new event during interpack 2014

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By admin on Thu, 03/21/2013 - 11:49

&nbsp&nbsp&nbsp&nbspcomponents for processing and packaging a new event during interpack 2014&nbspsuppliers to the packaging industry will be showing their products for three days next door to the flagship fair&nbspby introducing &ldquocomponents for processing and packaging&rdquo, messe d&uumlsseldorf is extending its offering in relation to interpack 2014. the event is taking place from 8 to 10 may 2014 during the first three days of the world&rsquos most important trade fair for the packaging sector and related processing industries. the venue is d&uumlsseldorf&rsquos city hall stadthalle in the congress center south ccd s&uumld at the d&uumlsseldorf exhibition grounds. the trade fair is targeted at companies specialising in motors and drive technology, control and sensor technology, products for machine vision, handling technology, industrial software and communication, and complete automation systems for packaging machines. it is also directed at manufacturers of machine parts, components, accessories and peripheral equipment and of components and auxiliaries for packaging means.&nbsp&ldquo&lsquocomponents for processing and packaging&rsquo is extending the breadth of the offering flanking interpack ti include the supplier side. although supplier companies may not exhibit at interpack itself under the fair&rsquos eligibility criteria, they can now benefit from the unique exhibitor diversity of interpack as the leading international fair. conversely, exhibitors at interpack only need to take a short walk to find out about their suppliers&rsquo products and services,&rdquo explains bernd jablonowski, director interpack. the idea of bringing interpack exhibitors and their suppliers together by introducing &ldquocomponents for processing and packaging&rdquo, an event aimed exclusively at the packaging and processing industry, was expressly welcomed by interpack&rsquos advisory council. this body consists of leading companies of the sector and the most important german associations for all exhibit categories at the flagship fair.&nbspto make participation as easy as possible for exhibitors at &ldquocomponents for processing and packaging&rdquo, stands are being offered in complete packages comprising stand construction, furnishings and power consumption in sizes of 9, 12 and 18 square metres. exhibitors at and visitors to interpack and &ldquocomponents for processing and packaging&rdquo can visit both fairs without having to buy a separate ticket. interested companies can register as of now at www.packagingcomponents.com. the allocation of exhibitor placements for &ldquocomponents for processing and packaging&rdquo starts on 1 october 2013.&nbsp

plas-tech engineering - Supplier for COC/COP PFS Syringes
YUKON MEDICAL
TARA NIRMAN
schreiner
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