the international show emballage and the dieline have launched a new packaging design event called the dieline summit in paris, an unmissable packaging design forum set to focus on rethinking the future of packaging design. a networking event focusing on the question what is the future of package design will be held on sunday, november 16th at bar la vue on the 34th floor of the hyatt regency etoile hotel, porte maillot, paris, from 6pm to 11pm. alex center, responsible for graphics, packaging and point of sale at coca cola, will be speaking at workshop one. the pass for the dieline summit includes the networking evening on sunday, november 16th 2014 and the conference sessions on monday, november 17th 2014. it is offered at an early booking rate of 980 including vat or can be booked at a discounted group rate. source www.mybadgeonline.comdielinedefault.aspxidlangueen
