future of packaging

Chicago, USA, October 14, 2018: FlexFilms is scaling newer heights with VYOM, a revolutionary futuristic technology Concept BOPET Film, it is presenting for the very first time for its visitors and customers at Pack Expo being hosted in Chicago from October 14 – October 17, 2018. FlexFilms Booth at Pack Expo is also showcasing a product portfolio of its latest innovations in BOPET Films - which range from high barrier films; more efficient films; and ones that are more sustainable too - all manufactured with its own proprietary technology.

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